Telephone：020-85581086 020-85580201
Mail：candarh@gztechno.com
Wechat：13602866979
Company Profile
Guangzhou Turknor Electronic Technology Co., Ltd. is a domestic company of Hong Kong Turknor Company. It has many years of professionals engaged in the electronics industry and has rich experience in sales and development in the electronics field. It is a professional supplier of diversified electronic bonding materials. Provide customers with necessary technical support and complete solutions.
The core products of the domestic company are electronic adhesives and slurries, with a comprehensive and professional product line. The products are mainly from the United States, and some are self-developed and produced in China. "Quality and cost are the best choice for circuit board & electronic component assembly" is the slogan advocated by our company. "Quality is life, cost is growth" is our company's corporate philosophy. Providing professional high-quality and low-cost products to customers is the direction our company pursues from beginning to end.
The company specializes in providing various electronic pastes and adhesives such as TECHBOND.The main products are:
● Conductive silver paste: TECHBOND silver paste has the characteristics of low resistance, strong adhesion, good hardness, good printability, good performance stability, and high temperature resistance. Typical applications are: touch screen (Touch Panel), RFID, membrane switch, flexible circuit board, medical products, sensors, printed touchpoints, radio frequency interference shielding, electroplating, multi-layer circuit board filling, EL cooling film, solar cells, photovoltaic cells, etc.
● Conductive adhesive: TECHBOND products have the advantages of high bonding strength, good electrical conductivity, high thermal conductivity and high temperature resistance. Typical applications are: semiconductor IC chip, electronic component (such as diode, sensor, tantalum capacitor, quartz crystal oscillator) assembly, touch screen (Touch Panel), electronic label (RFID), smart card, circuit assembly board (such as: COB bonded chip bonding Die attach), radio frequency circuits, medical products, solar cells, photovoltaic cells, etc.
● Carbon paste: TECHBOND carbon paste has the characteristics of low resistance, strong adhesion, good hardness and good printability. Typical applications are: membrane switches, flexible circuit boards, printed touchpoints, mobile phone buttons, etc.
● Screen printing pressure glue: The product has one-component and two-component, suitable for high-performance screen printing baking type pressure glue, with fast drying, good water resistance and adhesion. Used in touch screens, membrane switches, flexible circuit boards, buttons, etc.
● Insulating oil: This insulating oil is a baking type halogen-free insulating ink, which can be printed on silver paste layer, carbon paste layer and PET film. It has excellent adhesion, insulation and printability, and good hardness. Suitable for use in touch screen insulating oil membrane switches and EL luminescent sheets and other products.
● Peelable protective glue, commonly known as peelable blue glue, can be screen printed on the front and back of the touch screen ITO substrate. After curing, a protective film is formed, which plays a protective role in preventing pollution and scratches during the production process of the touch screen. Finally, it can be easily removed without leaving any traces. Features: high temperature resistance, corrosion resistance.
● UV adhesives: TECHBOND's various UV adhesives and visible light-curable adhesives can be used for bonding, potting, fixing and sealing applications. This series of products has the advantages of easy use, fast curing speed, high bonding strength, no pollution, stable performance, and easy to use. Mainly used for composite bonding of various glass products in the electronics industry, touch screen, optical fiber communication, lens assembly, watch industry, etc., and for potting open parts such as liquid crystal display (LCD).
● Bottom filler: It is necessary for the long-term reliability of flip-chip (such as: BGA, CSP, etc.) assembly. The glue reduces the stress of the solder joint and distributes the stress evenly on the interface of the flip-chip. The bottom filler has a great protective effect on the reliability of the chip from falling and thermal shock. TECHBOND's bottom filler has the characteristics of fast flow rate, rapid curing at low temperature, low temperature repairable, long storage stability and odorless. 30ml, 150ml and 250ml Packages are available.
● Low temperature thermosetting glue: The bonding between the mobile phone camera Lens Holder and the FPC is applied. It has the characteristics of strong adhesion, low volatilization, low stress, and can be quickly cured at low temperature.
● ALTECOInstant adhesive is famous for its high function and high strength, followed by fast speed, single ingredient, can be closely adhered to the material with smooth surface in a few seconds. Easy to use, no need to mix other products, no heating, and less usage. This product has no whitening, low whitening, low odor, and no volatilization. Scope of application: metal (stainless steel, iron, copper, aluminum) engineering plastics,ABSUnsaturated polyester, polyethylene, polypropylene, silicone rubber,EPDM、Rubber (natural rubber, butyl rubber), ceramic, fiber (carbon fiber, nylon) chlorinated rubber, leather, paper, phenolic resin, polystyrene, polyvinyl chloride, polycarbonate, polyurethane（PU）And wood products.
